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DC Field | Value | Language |
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dc.contributor.author | Satyanarayan | - |
dc.contributor.author | Kumarswamy, M.C. | - |
dc.contributor.author | Prabhu, K.N. | - |
dc.date.accessioned | 2020-03-31T08:45:43Z | - |
dc.date.available | 2020-03-31T08:45:43Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | Transactions of the Indian Institute of Metals, 2019, Vol.72, 6, pp.1545-1549 | en_US |
dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/13374 | - |
dc.description.abstract | In the current study, the influence of thermal ageing on evolution of microstructures in the interfacial region between solders (Sn 37Pb, Sn 3.5Ag 0.5Cu) and copper substrates was investigated. Pb-containing and Pb-free solders were reflowed on Cu substrates at 230 C for 15 min and were isothermally aged at 100 C for 24 h. As-reflowed Sn Pb solder/Cu substrate interfacial region exhibited continuous and layered type of IMC at the interface, and this IMC morphology changed to scallop type with isothermal ageing. SAC solder/Cu as-reflowed samples showed continuous and needle-shaped Cu6Sn5 and Ag3Sn IMCs at the interface. However, in an isothermally aged condition, plate-shaped Cu6Sn5 and flower-shaped Ag3Sn IMCs were found inside the solder matrix. Scanning electron microscopic (SEM) study showed that the thickness of Cu6Sn5 IMC was higher in reflowed Sn Pb/Cu region than in SAC/Cu region. 2019, The Indian Institute of Metals - IIM. | en_US |
dc.title | The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5Cu | en_US |
dc.type | Article | en_US |
Appears in Collections: | 1. Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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21 The Effect of Multi-Walled.pdf | 2.1 MB | Adobe PDF | View/Open |
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