Please use this identifier to cite or link to this item: https://idr.l1.nitk.ac.in/jspui/handle/123456789/13374
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dc.contributor.authorSatyanarayan-
dc.contributor.authorKumarswamy, M.C.-
dc.contributor.authorPrabhu, K.N.-
dc.date.accessioned2020-03-31T08:45:43Z-
dc.date.available2020-03-31T08:45:43Z-
dc.date.issued2019-
dc.identifier.citationTransactions of the Indian Institute of Metals, 2019, Vol.72, 6, pp.1545-1549en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/13374-
dc.description.abstractIn the current study, the influence of thermal ageing on evolution of microstructures in the interfacial region between solders (Sn 37Pb, Sn 3.5Ag 0.5Cu) and copper substrates was investigated. Pb-containing and Pb-free solders were reflowed on Cu substrates at 230 C for 15 min and were isothermally aged at 100 C for 24 h. As-reflowed Sn Pb solder/Cu substrate interfacial region exhibited continuous and layered type of IMC at the interface, and this IMC morphology changed to scallop type with isothermal ageing. SAC solder/Cu as-reflowed samples showed continuous and needle-shaped Cu6Sn5 and Ag3Sn IMCs at the interface. However, in an isothermally aged condition, plate-shaped Cu6Sn5 and flower-shaped Ag3Sn IMCs were found inside the solder matrix. Scanning electron microscopic (SEM) study showed that the thickness of Cu6Sn5 IMC was higher in reflowed Sn Pb/Cu region than in SAC/Cu region. 2019, The Indian Institute of Metals - IIM.en_US
dc.titleThe Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5Cuen_US
dc.typeArticleen_US
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