Please use this identifier to cite or link to this item:
https://idr.l1.nitk.ac.in/jspui/handle/123456789/13583Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Satyanarayan | - |
| dc.contributor.author | Prabhu, K.N. | - |
| dc.date.accessioned | 2020-03-31T08:48:13Z | - |
| dc.date.available | 2020-03-31T08:48:13Z | - |
| dc.date.issued | 2011 | - |
| dc.identifier.citation | Materials Science and Technology, 2011, Vol.27, 7, pp.1157-1162 | en_US |
| dc.identifier.uri | 10.1179/026708310X12815992418337 | - |
| dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/13583 | - |
| dc.description.abstract | Wetting behaviours of two lead free solders (Sn-2�625Ag- 2�25Zn and Sn-1�75Ag-4�5Zn) on nickel coated aluminium substrates were investigated. Sn-2�625Ag-2�25Zn exhibited better wettability compared to Sn-1�75Ag-4�5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2�625Ag-2�25Zn solder exhibited higher work of adhesion than Sn-1�75Ag-4�5Zn. A thin continuous layer of Ni 3Sn was detected at the interface between Sn-2�625Ag- 2�25Zn solder and nickel coated Al substrate. Sn-1�75Ag- 4�5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni 3Sn and Ni3Sn4 IMCs were observed at the interface of Sn-1�75Ag-4�5Zn solder and nickel coated Al. � 2011 Institute of Materials, Minerals and Mining. | en_US |
| dc.title | Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | 1. Journal Articles | |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.