Wetting behavior of lead-free solders on copper substrates

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DC Field	Value	Language
dc.contributor.author	Satyanarayan
dc.contributor.author	Prabhu, K.N.
dc.date.accessioned	2020-03-30T09:46:25Z	-
dc.date.available	2020-03-30T09:46:25Z	-
dc.date.issued	2013
dc.identifier.citation	IET Conference Publications, 2013, Vol.2013, 648 CP, pp.-	en_US
dc.identifier.uri	http://idr.nitk.ac.in/jspui/handle/123456789/6927	-
dc.description.abstract	The effect of substrate surface roughness on the wetting behavior of Sn-0.7Cu and Sn-0.3Ag-0.7Cu solder alloys on copper (Cu) substrates was investigated. The contact angles of both solder alloys decreased with increase in substrate surface roughness. The exponential power law (EPL), ? = exp (-K?n), was used to model the relaxation behaviour of solders. Solder spreading kinetics was successfully represented by the (EPL). EPL parameters (K and n) alloy decreased with an increase in surface roughness. Spreading of solder alloys on both substrates exhibited capillary, gravity and viscous regimes. High spreading rates in the capillary regime, moderate in gravity regime and almost constant rates in viscous regimes were observed.	en_US
dc.title	Wetting behavior of lead-free solders on copper substrates	en_US
dc.type	Book chapter	en_US
Appears in Collections:	2. Conference Papers

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