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https://idr.l1.nitk.ac.in/jspui/handle/123456789/7836
Title: | Effect of flexure beam geometry and material on the displacement of piezo actuated diaphragm for micropump |
Authors: | Roopa, R. Navin, Karanth, P. Kulkarni, S.M. |
Issue Date: | 2018 |
Citation: | IOP Conference Series: Materials Science and Engineering, 2018, Vol.310, 1, pp.- |
Abstract: | In this paper, we present a COMSOL analysis of flexure diaphragm for piezo actuated valveless micropump. Diaphragms play an important role in micropumps, till now plane diaphragms are commonly used in micropumps. Use of compliant flexure hinges in diaphragm and other MEMS application is one of the new approach to achieving high deflection in diaphragm at low operating voltage. Flexures hinges in diaphragm acts as simply supported beam. Out-off plane compliance value and stiffness is considered for the selection of proper flexure for diaphragm. Diaphragm material also plays an important role in the diaphragm central deflection. Factor considered for diaphragm material selection is resilience; it is the ratio of yield stress to static modulus. Higher is the resilience will leads to higher deflection generated, it also imparts good compliance. Based on the resilience beryllium copper, stainless steel and brass materials are selected for diaphragm analysis. Simulations have been performed using COMSOL multiphysics. This study reports the effect of flexure hinge geometry and diaphragm material on the central deflection of diaphragms and compared with existing plane diaphragm. Simulation results illustrates that the deflection of three flexure diaphragm with 2mm width and 2mm length flexure is 6.75?m for stainless steel, 10.89 for beryllium copper and 12.10?m for brass, at 140V which is approximately twice that of plane diaphragm deflection. The maximum in both plane and three flexure diaphragm deflection is obtained for brass diaphragm compared to stainless steel and beryllium copper. � Published under licence by IOP Publishing Ltd. |
URI: | http://idr.nitk.ac.in/jspui/handle/123456789/7836 |
Appears in Collections: | 2. Conference Papers |
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